Ultra Low Profile Copper Foil Mo te 5G High High Board
Ko te peera mata, he kanapa te mata me te taratara tino iti o nga taha e rua, ka tukuna ki te JIMA Copper te tikanga moroiti-taapiri ki te whakatutuki i te mahi punga teitei me te taratara iti hoki.He nui te mahi i roto i te whānuitanga o nga mara, mai i nga papa taiawhio taia maataki e aro nui ana ki nga taonga tuku me te hanga tauira pai ki nga iahiko taawari ngawari e aro nui ana ki te maarama.
●He ahua iti te ahua me te kaha kiri teitei me te kaha o te etch pai.
●Ko te hangarau o te Hyper Low coarsening, he mea tino pai te hangahanga moroiti hei tono ki te ara iahiko whakawhiti auau teitei.
●He māwhero te konumohe kua mahia.
●Iahiko whakawhiti auau teitei
●Teihana turanga/Tumau
●Mamati tere teitei
●PPO/PPE
whakarōpūtanga | Waeine | Tikanga Whakamatau | Tte Tikanga | |||
Te matotoru ingoa | Um | 12 | 18 | 35 | IPC-4562A | |
Taumaha Rohe | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
Maamaa | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
Te taratara | taha kanapa (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
Taha Maama(Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
Te Kaha Toka | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
Te whakaroa | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
Pinholes & Porosity | Tau | No | IPC-TM-650 2.1.2 | |||
Pte kaha tuna | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
Anti-hāoratanga | RT(23°C) | Nga ra | 90 |
| ||
RT(200°C) | Nga meneti | 40 |